A NUMERICAL ANALYSIS OF THERMAL MANAGEMENT FOR HIGH POWER LED STREET LIGHTS
نویسندگان
چکیده
منابع مشابه
Thermal Analysis of a high power LED multi-chip Package Module for Electronic Appliances
By using multiple high-power LEDs in products, some difficulties occur in predicting the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-chip LED module, solid physical models for both single-chip and multi-chip LEDs with cooling fins were constructed. Simulation of the temperature dis...
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اندیشمندان و صاحب نظران علوم اجتماعی بر این باورند که مرحله تازه ای در تاریخ جوامع بشری اغاز شده است. ویژگیهای این جامعه نو را می توان پدیده هایی از جمله اقتصاد اطلاعاتی جهانی ، هندسه متغیر شبکه ای، فرهنگ مجاز واقعی ، توسعه حیرت انگیز فناوری های دیجیتال، خدمات پیوسته و نیز فشردگی زمان و مکان برشمرد. از سوی دیگر قدرت به عنوان موضوع اصلی علم سیاست جایگاه مهمی در روابط انسانی دارد، قدرت و بازتولید...
15 صفحه اولThermal analysis of a high power LED multi-chip package module
Some difficulties occur by using multiple high-power LEDs in products to predict the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-chip LED module, solid physical models for both single-chip and multi-chip LEDs with cooling fins were constructed. Simulation of the temperature distrib...
متن کاملThermal analysis of high power LED package with heat pipe heat sink
The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistan...
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ژورنال
عنوان ژورنال: International Journal of Research in Engineering and Technology
سال: 2018
ISSN: 2321-7308,2319-1163
DOI: 10.15623/ijret.2018.0702007